DOCBOND|Underfill DB840B
- Company Name:Qingdao Docbond New Material Co.,Ltd
- Membership:Free Member
- Member Since:2023. 02.02
- Country/Region:China
- City:Shandong
- Contact:CHONGLE LIANG
- Related Keywords:waterproof glue, DOCBOND, Underfill
Qingdao Docbond New Material Co.,Ltd- Home
- Products
- Electronic Glue
- DOCBOND|Underfill DB840B
Contact us
Qingdao Docbond New Material Co.,Ltd
[China]
- Address
- No. 628, Jiushui East Road, Laoshan District Qingdao Shandong
- Phone
- 86-0532-81700039
- Contact name
- CHONGLE LIANG
Quick Information
- Brand Name: Underfill
- Place of Origin: China
- Model Number : DB840B
- :
Description
DB840B
The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for better underfilling; and good reworkability.
Product Image
Other products from this supplier
){kind=link}
Browse: Manufacturer Directory Premium Suppliers Site Map
About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy
Copyright (c)1997-2026 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese
Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838