DOCBOND|Low Temperature Curing Adhesive
- Company Name:Qingdao Docbond New Material Co.,Ltd
- Membership:Free Member
- Member Since:2023. 02.02
- Country/Region:China
- City:Shandong
- Contact:CHONGLE LIANG
- Related Keywords:DOCBOND, glue, Curing Adhesive
Qingdao Docbond New Material Co.,Ltd- Home
- Products
- Electronic Glue
- DOCBOND|Low Temperature Curing Adhesive
Contact us
Qingdao Docbond New Material Co.,Ltd
[China]
- Address
- No. 628, Jiushui East Road, Laoshan District Qingdao Shandong
- Phone
- 86-0532-81700039
- Contact name
- CHONGLE LIANG
Quick Information
- Brand Name: LowTemperatureCuringAdhesive
- Place of Origin: China
- Model Number : DB291
- :
Description
DB291
This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.
Product Image
Other products from this supplier
){kind=link}
Browse: Manufacturer Directory Premium Suppliers Site Map
About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy
Copyright (c)1997-2026 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese
Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838